Hybrid Metal–Dielectric Nanophotonics

The technological development of modern devices is driven by the miniaturization of systems and the transition from electrical to optical signal processing, as conventional electronic information-processing technologies are approaching their fundamental limits. This has led to the development of integrated photonic chips — multifunctional photonic devices that combine multiple components on a single substrate. The transition from electronic to optical chips involves the gradual replacement of electronic components with their optical counterparts, enabling new records in information processing and transmission speed, as well as new approaches to information storage and security.

The advances and knowledge gained in the development of next-generation devices have contributed to the emergence of hybrid nanophotonics as a research field focused on the interaction of light with materials and structures at the nanoscale, typically ranging from 1 to 100 nanometers.

The key concept of this field is to combine the advantages of metals with those of high-refractive-index materials, including dielectrics and semiconductors, within a single nanostructure. This provides greater flexibility in engineering the optical properties of devices and opens up new possibilities for developing advanced passive and active components for integrated photonic chips.